1300 nm 1x9 transceiver reliability data this reliability data sheet describes newly released transceivers for atm/sonet oc-3, fddi, fibre channel, fast ethernet and 100 base vg anylan. hfbr-5103/5105/5106/ 5204/5205/5301/5302 hfbr-5103t/5105t/ 5106t/5204t/5205t a. demonstrated performance stress test total units total demonstrated demonstrated test name conditions device hrs. tested failed mtbf @ fits @ t a = 100 ct a = 100 c high temperature v cc = 5.0 vdc 90,000 45 0 90,000 C operating life t a = 100 c 48,000 48 0 48,000 C see note 1. 72,000 24 0 72,000 C 32,000 16 0 32,000 C 7,500 5 0 7,500 C total 249,500 138 0 249,500 4,008 failure rate prediction the demonstrated point mtbf given on this data sheet is on device performance at maximum allowed stress conditions. tem- perature is an alterable stress. the failure rate will have a direct relationship to the life stress. mil- hdbk-217 uses, for this type of product (hybrid packaging), a 0.43 electron volt activation energy which represents the most conser- vative temperature acceleration reported. estimates for typical equipment use temperatures are as follows: 1. life test the following demonstrated data represents information based upon the high temperature operating life tests on hfbr-5103 fddi transceiver. definition of failure product failure has occurred when the unit fails to respond properly to a dc/ac functional test condi- tion. the functional test condition shall not exceed the absolute maximum data sheet limits for the product. point typical performance 90% confidence level ambient temp. mtbf fits mtbf fits ( c) 100 249,000 4,000 108,000 9,220 95 299,000 3,340 129,000 7,690 90 360,000 2,770 156,000 6,380 85 437,000 2,280 189,000 5,260 80 532,000 1,870 231,000 4,320 75 652,000 1,530 283,000 3,520 70 803,000 1,240 349,000 2,860 65 997,000 1,000 433,000 2,300 60 1,240,000 803 540,000 1,850 55 1,560,000 640 679,000 1,470 50 1,970,000 500 859,000 1,160 45 2,520,000 390 1,090,000 910 40 3,240,000 300 1,400,000 710 35 4,190,000 240 1,820,000 550 30 5,480,000 180 2,380,000 420 25 7,230,000 140 3,140,000 320
2 2. mechanical and environmental tests (testing done on a constructional basis) test conditions duration sample size failure (hfbr-5103) temp. cycle 1 0 c to 100 c, 1000 cycles 21 0 15 min. dwell 5 min. transfer temp. cycle 2 -40 c to 100 c, 1000 cycles 40 0 15 min. dwell 5 min. transfer temp. cycle 3 -40 c to 150 c, 1000 cycles 4 0 15 min. dwell 5 min. transfer 85/85 t a = 85 c, 85% rh, 1000 hours 59 0 biased v cc = +5 v. (see note 1) 85/85 t a = 85 c, 85% rh, 240 hours 44 0 storage v cc = 0 v power cycle, mil-std-883 method 1000 hours 40 0 temp. cycle & 1004, power on/off humidity @ 30 min./30 min. (see note 1) ltol t a = -40 c, 2000 hours 11 0 v cc = +5 v (see note 1) high temp t a = 150 c, 1000 hours 3 0 storage v cc = 0 thermal -40 c to 100 c, 100 cycles 11 0 shock 5 min. dwell, 5 sec. transfer mechanical mil-std-883 method 11 0 shock 2002a, 500g 6 directions mechanical mil-std-883 method 11 0 vibration 2007a 20-2000 hz, 20g lead / terminal mil-std-883, method 1 kg tensile pull applied to 10 0 strength 2004.5 / 1 kg tensile pull, each lead for 10 sec., then 10 sec./ 1 kg bending bend lead 30 while pull, 3 sec., 30 deg. under pull for 3 sec. 3 bendings each lead. wave soldering 2 sec. on 260 c solder; 3 times 193 0 5 min. wash in 60-70 c di water under 40 psi; 20 min. bake @ 70 c hand soldering 315 c - 10 sec. 4 0 and resistance hand soldering, to solvents followed by resistance to solvents per mil- std-883 method 2015.7
3 test conditions duration sample size failure (hfbr-5103) solder post lift housing from 2 min. force: 4 kg pullout pcb and measure (test done on max. force: break force hfbr-5103t package) >10 kg side load apply forces 6 side pull: 10 kg (snap joint perpendicular to (test done on up pull on port: strength) ports and measure hfbr-5103t package) 5 - 7 kg break forces. up pull on ports: 7.6 kg 500 reconnects t a = 25 c electrical and optical 4 transceivers paired pt av variation: port wear test 1 500 connections measurements on all with 4 connectored -0.33 dbm max.; performed on each transceivers at cables of different pr mid 4.0 transceiver paired 100, 200, 300, 400 manufacturer. variation. with one each and 500 connections -0.06 dbm max. connectored cable. 500 reconnects t a = 25 c electrical and optical 4 transceivers paired pt av port wear test 2 500 connections measurements on all with 2 connectored variation: performed on each transceivers at cables of different -0.19 dbm max. transceiver paired 100, 200, 300, 400 manufacturer; one with one each and 500 connections. cable paired with 2 connectored cable. transceivers live monitor pt av. 2. mechanical and environmental tests (contd) (testing done on a constructional basis) 3. electrostatic discharge information (testing done on a constructional basis) test conditions duration sample size failure (hfbr-5103) esd 1 mil-std-883 2200 v 9 0 method 3015.4 (class 2) (human body model) esd 2 eiaj#1988.3.2b, apply + then - voltage to 5 0 version 2, each pin and gnd once, c = 200 pf, r = 0 100 volts (machine model) esd 3 iec 801.2, 10 single discharges min. 13 0 25 kv applied repeatedly about (simulation of the top, bottom, sides and discharges from human front of receptacle. repeat body to d.u.t.) test with discharges applied to the top of entire module. note 1: both the transmitter and receiver of each transceiver were connected by a loop-back connectored cable in this test and operated in a self-oscillation mode.
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies 5963-5609e (11/99)
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